Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15311152
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Filing Dt:
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11/14/2016
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Publication #:
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Pub Dt:
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06/08/2017
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Inventors:
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Zhe WANG, Quanbo ZOU
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Title:
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FULLY WAFER-LEVEL-PACKAGED MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.268 DONGFANG ROAD |
| HI-TECH INDUSTRY DEVELOPMENT DISTRICT |
| WEIFANG, SHANDONG, CHINA 261031 |
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| KNOBBE, MARTENS, OLSON & BEAR, LLP. |
| 2040 MAIN STREET, 14TH FLOOR |
| IRVINE, CA 92614 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 103, NO.396 SONGLING ROAD |
| LAOSHAN DISTRICT |
| QINGDAO, SHANDONG, CHINA 266104 |
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| TROUTMAN SANDERS LLP |
| 875 THIRD AVENUE |
| 17 FLOOR |
| NEW YORK, NY 10022 |
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