Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/11/2019
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Application #:
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15528487
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Filing Dt:
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05/19/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Inventors:
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Hyung Sub LEE, Min Seung SHIN, Sung Won HONG, Min Cheol JU, In Soo KIM
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Title:
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THERMOPLASTIC RESIN AND THERMOPLASTIC RESIN COMPOSITION INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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