Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/2019
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Application #:
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16028504
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Filing Dt:
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07/06/2018
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Inventor:
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Wei-Chung HSIAO
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Title:
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HEAT DISSIPATION AND SHOCKPROOF STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F, NO.1, R&D ROAD 2, HSINCHU SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU COUNTY, TAIWAN |
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NELSON QUINTERO |
615 HAMPTON DRIVE SUITE A202 |
VENICE, CA 90291 |
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06/16/2024 02:14 PM
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