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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10332839
Issue Dt:
06/25/2019
Application #:
15400600
Filing Dt:
01/06/2017
Publication #:
20180197819
Pub Dt:
07/12/2018
Inventors:
Keen Zhang, Ji Feng, De-Jin Kong, Yun-Fei Li, Guo-Hai Zhang, Ching-Hwa Tey, Jing Feng
Title:
INTERCONNECT STRUCTURE AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
040876/0178Recorded: 01/06/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHANG, KEEN
Exec Dt:
12/15/2016
FENG, JI
Exec Dt:
12/15/2016
KONG, DE-JIN
Exec Dt:
12/15/2016
LI, YUN-FEI
Exec Dt:
12/15/2016
ZHANG, GUO-HAI
Exec Dt:
12/15/2016
TEY, CHING-HWA
Exec Dt:
12/20/2016
FENG, JING
Exec Dt:
12/27/2016
Assignee:
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
J.C. PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618
Assignment: 2
Reel/Frame:
056991/0292Recorded: 07/26/2021Pages: 37
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
UNITED MICROELECTRONICS CORPORATION
Exec Dt:
06/18/2021
Assignee:
MARLIN SEMICONDUCTOR LIMITED
BRACKEN ROAD, SANDYFORD
FIRST FLOOR, BLACKTHORN EXCHANGE
DUBLIN, IRELAND D18 P3Y9
Correspondent:
LONGITUDE LICENSING LTD
BRACKEN ROAD, SANDYFORD
FIRST FLOOR, BLACKTHORN EXCHANGE
DUBLIN, D18 P3Y9 IRELAND

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