Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/02/2019
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Application #:
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14587205
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Filing Dt:
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12/31/2014
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Publication #:
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Pub Dt:
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12/24/2015
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Inventors:
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Jo Han KIM, Kyeong Su KIM, Hee Jin PARK, Jae Jin LEE
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Title:
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HEAT RELEASING SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, 361-725 |
CHEONGJU-SI, KOREA, REPUBLIC OF 361-725 |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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Assignment:
2
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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15F, 76 JIKJI-DAERO, 436BEON-GIL (JIKJI SMART TOWER), HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28581 |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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