Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/02/2019
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Application #:
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15701051
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Filing Dt:
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09/11/2017
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Publication #:
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Pub Dt:
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03/14/2019
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Inventors:
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CHI-CHIH SHEN, KUO-HSIUNG LI, JUI-CHENG CHUANG
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Title:
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OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5F., NO. 5, INNOVATION ROAD I, HSINCHU SCIENCE PARK |
HSIN-CHU, TAIWAN |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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09/23/2024 06:55 PM
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