Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/09/2019
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Application #:
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15816973
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Filing Dt:
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11/17/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Ji Guang Zhu, Hai Ting Li
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Title:
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METHOD OF FORMING INTERCONNECT STRUCTURE WITH PARTIAL COPPER PLATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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18 ZHANG JIANG ROAD |
PUDONG NEW AREA |
SHANGHAI, CHINA 201203 |
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18 WEN CHANG ROAD, ECONOMICAL-TECHNOLOGICAL |
DEVELOPMENT AREA, DAXING DISTRICT |
BEIJING, CHINA 100176 |
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KILPATRICK TOWNSEND AND STOCKTON LLP |
TWO EMBARCADERO CENTER |
EIGHTH FLOOR |
SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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18 ZHANGJIANG ROAD, PUDONG NEW AREA |
SHANGHAI, CHINA 201203 |
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9TH FLOOR, NO. 700 SIMINGSHAN ROAD, BEILUN DISTRICT |
NINGBO, CHINA 315800 |
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ANOVA LAW GROUP PLLC |
21495 RIDGETOP CIRCLE, SUITE 300 |
STERLING, VA 20166 |
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