Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/30/2019
|
Application #:
|
15856065
|
Filing Dt:
|
12/28/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2019
| | | | |
|
Inventors:
|
Wei-Yuan Cheng, Shu-Wei Kuo, Shau-Fei Cheng
|
|
Title:
|
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRUCTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
| HSINCHU, TAIWAN 31040 |
|
|
|
| RM.417, BLDG. 52, NO. 195, SEC. 4, CHUNG-HSING RD., CHU-TUNG, |
| HSINCHU, TAIWAN |
|
|
|
|
| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
|
|
Search Results as of:
05/13/2024 12:37 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
