Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15674062
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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11/23/2017
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Inventors:
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CHIH-CHENG HSIEH, HSIU-WEN HSU
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Title:
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FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12F., NO.368, GONGJIAN RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
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| 6F., NO.366, GONGJIAN RD., 6F., NO.366, GONGJIAN RD. |
| NEW TAIPEI CITY, TAIWAN 221 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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