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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/20/2019
Application #:
15290557
Filing Dt:
10/11/2016
Publication #:
Pub Dt:
04/20/2017
Inventor:
Minoru KAI
Title:
PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
Assignment: 1
Reel/Frame:
039987/0246Recorded: 10/11/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/15/2016
Assignee:
1913-2, FUKURA, USUKI-CITY
OITA, JAPAN 8750053
Correspondent:
TYPHA IP LLC
1819 L STREET NW SUITE 200
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
053242/0422Recorded: 07/17/2020Pages: 16
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2020
Assignee:
1913-2, TAKEGASHITA FUKURA
USUKI-SHI, OITA, JAPAN 875-0053
Correspondent:
LAW OFFICE OF KEVIN B. JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, AZ 85253-8006

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