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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10388736
Issue Dt:
08/20/2019
Application #:
15695526
Filing Dt:
09/05/2017
Publication #:
20180047813
Pub Dt:
02/15/2018
Inventors:
Horst Schäfer, Gerhard Prechtl, Oliver Häberlen
Title:
Methods of Forming Substrate Structures and Semiconductor Components
Assignment: 1
Reel/Frame:
043490/0037Recorded: 09/05/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PRECHTL, GERHARD
Exec Dt:
03/16/2016
SCHAFER, HOST
Exec Dt:
03/08/2016
HABERLEN, OLIVER
Exec Dt:
03/14/2016
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
044638/0641Recorded: 11/01/2017Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA NAME PREVIOUSLY RECORDED AT REEL: 043490 FRAME: 0037. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
PRECHTL, GERHARD
Exec Dt:
03/16/2016
SCHÄFER, HORST
Exec Dt:
03/08/2016
HÄBERLEN, OLIVER
Exec Dt:
03/14/2016
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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