Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2019
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Application #:
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14735559
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Filing Dt:
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06/10/2015
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Publication #:
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Pub Dt:
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11/10/2016
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Inventors:
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Lei-Lei LIU, CHIEN-HUNG SUN
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Title:
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COOLING MODULE, WATER-COOLED COOLING MODULE AND COOLING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 778-1, CHUNG-CHENG RD., ZHONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN 235 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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