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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/10/2019
Application #:
14988753
Filing Dt:
01/06/2016
Publication #:
Pub Dt:
07/28/2016
Inventors:
Shui-Fa TSAI, Chang-Han TSAI
Title:
LIQUID COOLING HEAT SINK STRUCTURE AND COOLING CIRCULATION SYSTEM THEREOF
Assignment: 1
Reel/Frame:
037415/0124Recorded: 01/06/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/23/2015
Exec Dt:
01/04/2016
Assignee:
9F., NO. 778-1, CHUNG-CHENG RD., ZHONGHE DIST.,
NEW TAIPEI CITY, TAIWAN 235
Correspondent:
HDLS IPR SERVICES
P.O. BOX 230970
CENTREVILLE, VA 20120

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