Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2019
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Application #:
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15937984
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Filing Dt:
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03/28/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Man-Hee Han, Dae-Sang Chan, Sung-il Cho, Jung-Lae Jung
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Title:
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Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semiconductor Chip Including the Jig, and Method of Bonding a Semiconductor Chip Using the Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| WARD AND SMITH, P.A. |
| 5430 WADE PARK BLVD |
| WADE II, SUITE 400 |
| RALEIGH, NC 27636-3009 |
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