Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/24/2019
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Application #:
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15388906
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Filing Dt:
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12/22/2016
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Publication #:
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Pub Dt:
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06/28/2018
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Inventors:
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Feras Eid, Johanna M. Swan, Sasha N. Oster, Shawna M. Liff, Nader N. Abazarnia et al
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Title:
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Thermal Management of Molded Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| TROP, PRUNER & HU, P.C. |
| 1616 S. VOSS RD., SUITE 750 |
| HOUSTON, TX 77057-2631 |
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