Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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15561376
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Filing Dt:
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09/25/2017
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Publication #:
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Pub Dt:
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07/12/2018
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Inventors:
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Hyun Hyub KO, Ho Chan LEE
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Title:
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THERMORESPONSIVE SMART ADHESIVE PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 50, UNIST-GIL |
| EONYANG-EUP, ULJU-GUN ULSAN, KOREA, REPUBLIC OF 44919 |
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| CASIMIR JONES, S.C. |
| 2275 DEMING WAY, SUITE 310 |
| MIDDLETON, WI 53562 |
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