Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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15869517
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Filing Dt:
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01/12/2018
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Publication #:
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Pub Dt:
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02/14/2019
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Inventors:
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Young-Iyong KIM, Hyun-soo CHUNG, Dong-hyeon JANG
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Title:
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SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE 1ST INVENTOR FIRST NAME WAS MISSPELLED PREVIOUSLY RECORDED ON REEL 044611 FRAME 0901. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| GARY D. YACURA |
| 11730 PLAZA AMERICA DRIVE |
| SUITE 600 |
| RESTON, VA 20190 |
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