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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/15/2019
Application #:
15585289
Filing Dt:
05/03/2017
Publication #:
Pub Dt:
05/31/2018
Inventors:
Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng et al
Title:
High-Density Semiconductor Device
Assignment: 1
Reel/Frame:
042222/0399Recorded: 05/03/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/16/2017
Exec Dt:
03/16/2017
Exec Dt:
03/24/2017
Exec Dt:
03/16/2017
Exec Dt:
03/24/2017
Exec Dt:
03/24/2017
Exec Dt:
03/25/2017
Exec Dt:
03/16/2017
Exec Dt:
03/16/2017
Exec Dt:
03/23/2017
Exec Dt:
03/23/2017
Exec Dt:
04/20/2017
Assignee:
NO. 8, LI-HSIN RD. VI
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
JONES DAY
250 VESEY STREET
NEW YORK, NY 10281-1047

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