Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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15853345
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Filing Dt:
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12/22/2017
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Publication #:
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Pub Dt:
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06/27/2019
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Inventors:
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Amit Sureshkumar NANGIA, Siva Prakash GURRUM, Janakiraman SEETHARAMAN
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Title:
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SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, M/S 3999 |
| DALLAS, TX 75265 |
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