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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/15/2019
Application #:
15970724
Filing Dt:
05/03/2018
Publication #:
Pub Dt:
11/07/2019
Inventors:
Jason G. Milne, Tse E. Wong, Yung-Cheng Lee
Title:
MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE FOR LOW DIE STRESS
Assignment: 1
Reel/Frame:
045711/0903Recorded: 05/03/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/16/2018
Exec Dt:
04/04/2018
Assignee:
870 WINTER STREET
WALTHAM, MASSACHUSETTS 02451-1449
Correspondent:
DOCKET CLERK-RAYTHEON/MWM
P.O.DRAWER 800889
DALLAS, TX 75380
Assignment: 2
Reel/Frame:
046041/0242Recorded: 06/11/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/07/2018
Assignee:
5429 ILLINI WAY
BOULDER, COLORADO 80303
Correspondent:
DOCKET CLERK-RAYTHEON/MWM
P.O. DRAWER 800889
DALLAS, TX 75380
Assignment: 3
Reel/Frame:
061572/0054Recorded: 07/26/2022Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY OF THE ASSIGNEE. PREVIOUSLY RECORDED AT REEL: 046041 FRAME: 0242. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignor:
Exec Dt:
05/31/2022
Assignee:
1800 GRANT STREET, 8TH FLOOR
DENVER, COLORADO 80203
Correspondent:
SANDERS IP
240 N EAST PROMONTORY
SUITE 200
FARMINGTON, UT 84025

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