Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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16100456
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Filing Dt:
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08/10/2018
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Inventors:
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Mark J. Beesley, Shyam Harindralal Ratnayake, Kenneth Leland Kiplinger et al
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Title:
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Connection Pad for Embedded Components in PCB Packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE APPLE PARK WAY |
CUPERTINO, CALIFORNIA 95014 |
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MICHAEL G. FLETCHER |
P.O. BOX 692289 |
FLETCHER YODER |
HOUSTON, TX 77269-2289 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FIFTH ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 046612 FRAME: 0033. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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ONE APPLE PARK WAY |
CUPERTINO, CALIFORNIA 95014 |
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MICHAEL G. FLETCHER |
P.O. BOX 692289 |
FLETCHER YODER |
HOUSTON, TX 77269-2289 |
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