Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/05/2019
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Application #:
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15874602
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Filing Dt:
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01/18/2018
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Publication #:
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Pub Dt:
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05/24/2018
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Inventors:
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Seung Woo Lee, Byong Jin Kim, Sang Goo Kang, Won Bae Bang
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON ST., FLOOR 34 |
CHICAGO, IL 60661 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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333 SOUTH HOPE STREET |
19TH FLOOR |
LOS ANGELES, CALIFORNIA 90071 |
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MCGUIREWOODS LLP |
1750 TYSONS BOULEVARD |
SUITE 1800 |
TYSONS, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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09/27/2024 06:50 PM
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