Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/19/2019
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Application #:
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15907600
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Filing Dt:
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02/28/2018
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Publication #:
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Pub Dt:
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07/05/2018
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Inventors:
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Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu et al
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Title:
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SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 388, JIANG CHUAN EAST ROAD |
MINHANG DISTRICT |
SHANGHAI, CHINA 200241 |
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VIERRA MAGEN MARCUS LLP |
101 MISSION STREET, SUITE 400 |
SAN FRANCISCO, CA 94105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5601 GREAT OAKS PKWY. |
LEGAL DEP. |
SAN JOSE, CALIFORNIA 95119 |
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WESTERN DIGITAL TECHNOLOGIES |
5601 GREAT OAKS PKWY |
LEGAL DEP. |
SAN JOSE, CA 95119 |
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