Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2019
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Application #:
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15676415
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Filing Dt:
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08/14/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Inventors:
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Merrill Albert Hatcher JR., Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa et al
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Title:
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WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7628 THORNDIKE ROAD |
GREENSBORO, NORTH CAROLINA 27409 |
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QORVO AND WITHROW + TERRANOVA |
106 PINEDALE SPRINGS WAY |
CARY, NC 27511 |
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