Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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16152182
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Filing Dt:
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10/04/2018
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Publication #:
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Pub Dt:
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10/03/2019
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Inventors:
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John D. Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson, Yucheng Ying
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Title:
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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE TECHNOLOGY WAY |
NORWOOD, MASSACHUSETTS 02062 |
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PATENT LAW GROUP LLP |
PO BOX 61839 |
SUNNYVALE, CA 94088 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BAY F1 RAHEEN INDUSTRIAL ESTATE |
LIMERICK, IRELAND |
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KNOBBE, MARTENS, OLSON & BEAR, LLP |
2040 MAIN STREET |
14TH FLOOR |
IRVINE, CA 92614 |
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09/23/2024 04:35 AM
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