Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/10/2019
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Application #:
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14854098
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Filing Dt:
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09/15/2015
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Publication #:
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Pub Dt:
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02/09/2017
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Inventors:
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Kyung Hak Lee, Min Seok HAN, Young Ki KIM
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Title:
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METHOD OF PACKAGING A POWER AMPLIFIER MODULE HAVING A UNIFIED PATTERN AND CERAMIC SIDEWALL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 312, IT CONFERGENCE CENTER (N1) |
291, DAHAK-RO, YUSEONG-GU |
DAEJEON, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 34141 |
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BLANK ROME LLP |
600 NEW HAMPSHIRE AVENUE, NW |
WASHINGTON, DC 20037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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307, 291, DAEHAK-RO |
YUSEONG-GU DAEJEON, KOREA, REPUBLIC OF 34141 |
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BLANK ROME LLP |
1825 EYE STREET, NW |
WASHINGTON, DC 20006 |
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