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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/10/2019
Application #:
14854098
Filing Dt:
09/15/2015
Publication #:
Pub Dt:
02/09/2017
Inventors:
Kyung Hak Lee, Min Seok HAN, Young Ki KIM
Title:
METHOD OF PACKAGING A POWER AMPLIFIER MODULE HAVING A UNIFIED PATTERN AND CERAMIC SIDEWALL
Assignment: 1
Reel/Frame:
036575/0185Recorded: 09/16/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2015
Exec Dt:
09/10/2015
Exec Dt:
09/10/2015
Assignee:
NO. 312, IT CONFERGENCE CENTER (N1)
291, DAHAK-RO, YUSEONG-GU
DAEJEON, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 34141
Correspondent:
BLANK ROME LLP
600 NEW HAMPSHIRE AVENUE, NW
WASHINGTON, DC 20037
Assignment: 2
Reel/Frame:
051856/0142Recorded: 02/19/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/30/2020
Assignee:
307, 291, DAEHAK-RO
YUSEONG-GU DAEJEON, KOREA, REPUBLIC OF 34141
Correspondent:
BLANK ROME LLP
1825 EYE STREET, NW
WASHINGTON, DC 20006

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