Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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13177395
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Filing Dt:
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07/06/2011
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Publication #:
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Pub Dt:
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01/10/2013
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Inventors:
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Tsun-Jen Chan, Yh-Hsiu Hsiao, Lu Cheng-Ta, Jian-Hong Wu
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Title:
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Techniques Providing Semiconductor Wafer Grouping In A Feed Forward Process
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE LLP |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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