Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2020
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Application #:
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15993606
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Filing Dt:
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05/31/2018
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Publication #:
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Pub Dt:
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12/05/2019
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Inventors:
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Chun-Han CHIANG, Fu-Yu CHUANG, Yao-Wen CHANG, Chih-Che LIN, Chun-Yi YANG
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Title:
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Method of Redistribution Layer Routing for 2.5-Dimensional Integrated Circuit Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 101, SEC. 2, KUANG-FU RD., |
| INNOVATION & INCUBATION HALL, NATIONAL TSING HUA UNIVERSITY |
| HSINCHU CITY, TAIWAN 30013 |
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| CHIH FENG YEH |
| 188 OLD CASTLE POINT RD. |
| WAPPINGERS FALLS, NY 12590-7069 |
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