Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/10/2020
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Application #:
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14107446
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Filing Dt:
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12/16/2013
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Publication #:
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Pub Dt:
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07/31/2014
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Inventors:
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Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang et al
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Title:
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ELECTRONIC PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| EDWARDS WILDMAN PALMER LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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