Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/17/2020
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Application #:
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15555359
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Filing Dt:
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09/01/2017
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Publication #:
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Pub Dt:
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03/08/2018
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Inventor:
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Dong-woo LEE
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Title:
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LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (4TH FL, SEOKU-DONG) 60, SAMSUNG 1-RO 2-GIL HWASEONG-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 445-170 |
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| PETER S. WEISSMAN |
| 1825 EYE STREET, NW |
| WASHINGTON, DC 20006 |
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