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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
10600770
Issue Dt:
03/24/2020
Application #:
15978778
Filing Dt:
05/14/2018
Publication #:
20190348406
Pub Dt:
11/14/2019
Inventors:
Eiichi Nakano, Shiro Uchiyama
Title:
SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF OPERATION
Assignment: 1
Reel/Frame:
045796/0906Recorded: 05/14/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAKANO, EIICHI
Exec Dt:
05/08/2018
UCHIYAMA, SHIRO
Exec Dt:
05/14/2018
Assignee:
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY
MAILSTOP 1-507
BOISE, IDAHO 83707-0006
Correspondent:
TRASK BRITT, P.C./ MICRON TECHNOLOGY
P.O. BOX 2550
SALT LAKE CITY, UT 84110
Assignment: 2
Reel/Frame:
045832/0007Recorded: 05/17/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAKANO, EIICHI
Exec Dt:
05/08/2018
UCHIYAMA, SHIRO
Exec Dt:
05/14/2018
Assignee:
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY
MAILSTOP 1-507
BOISE, IDAHO 83707-0006
Correspondent:
TRASK BRITT, P.C.
P.O. BOX 2550
SALT LAKE CITY, UT 84110
Assignment: 3
Reel/Frame:
047540/0001Recorded: 07/13/2018Pages: 843
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MICRON TECHNOLOGY, INC.
Exec Dt:
07/03/2018
MICRON SEMICONDUCTOR PRODUCTS, INC.
Exec Dt:
07/03/2018
Assignee:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
10 S. DEARBORN
7TH FLOOR
CHICAGO, ILLINOIS 60603
Correspondent:
MARCELA ROBLEDO
2475 HANOVER STREET
PALO ALTO, CA 94304
Assignment: 4
Reel/Frame:
047282/0463Recorded: 08/09/2018Pages: 40
Conveyance:
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT
Assignor:
MICRON TECHNOLOGY, INC.
Exec Dt:
07/31/2018
Assignee:
MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
1300 THAMES STREET
4TH FLOOR
BALTIMORE, MARYLAND 21231
Correspondent:
MARCELA ROBLEDO
2475 HANOVER STREET
PALO ALTO, CA 94304
Assignment: 5
Reel/Frame:
050713/0001Recorded: 10/11/2019Pages: 43
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignee:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105
Assignment: 6
Reel/Frame:
051028/0001Recorded: 11/12/2019Pages: 834
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignees:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
MICRON SEMICONDUCTOR PRODUCTS, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105

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