Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/2020
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Application #:
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15402087
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Filing Dt:
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01/09/2017
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Publication #:
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Pub Dt:
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07/13/2017
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Inventors:
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Chieh Chen, Tsung-Hsi Wang, Junwei Chung
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Title:
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RECESSED CHIP SCALE PACKAGING LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2F. NO 29, GONGYE E. 9TH RD |
HSINCHU COUNTY, TAIWAN 30075 |
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FOLEY & LARDNER LLP |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007 |
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09/25/2024 09:49 PM
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