Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
04/07/2020
|
Application #:
|
15838409
|
Filing Dt:
|
12/12/2017
|
Publication #:
|
|
Pub Dt:
|
06/13/2019
| | | | |
Inventors:
|
Gad Joseph Hubahib Gaviola, Vincent Wai Hung, Margarito P. Banal JR., Vivian Wei Ma
|
Title:
|
HEAT DISSIPATION SYSTEM OF ENCLOSED ELECTRONIC MODULE WITH SINGLE/MULTIPLE ACTIVE COMPONENTS
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
HONG KONG SCIENCE PARK, SHATIN, N.T. |
HONG KONG, HONG KONG |
|
|
|
B.Y.I.P., LTD |
P.O. BOX 1484 |
GENERAL POST OFFICE |
HONG KONG, HONG KONG |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
3/F, SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
HONG KONG, HONG KONG |
|
|
|
B.Y.I.P., LTD |
P.O. BOX 1484 OF GENERAL POST OFFICE |
HONG KONG, HONG KONG |
|
|
Search Results as of:
10/31/2024 07:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|