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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/07/2020
Application #:
15838409
Filing Dt:
12/12/2017
Publication #:
Pub Dt:
06/13/2019
Inventors:
Gad Joseph Hubahib Gaviola, Vincent Wai Hung, Margarito P. Banal JR., Vivian Wei Ma
Title:
HEAT DISSIPATION SYSTEM OF ENCLOSED ELECTRONIC MODULE WITH SINGLE/MULTIPLE ACTIVE COMPONENTS
Assignment: 1
Reel/Frame:
044375/0972Recorded: 12/13/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/08/2017
Exec Dt:
12/08/2017
Exec Dt:
12/08/2017
Exec Dt:
12/08/2017
Assignee:
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE
HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
Correspondent:
B.Y.I.P., LTD
P.O. BOX 1484
GENERAL POST OFFICE
HONG KONG, HONG KONG
Assignment: 2
Reel/Frame:
046569/0754Recorded: 07/18/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/13/2018
Assignee:
3/F, SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
Correspondent:
B.Y.I.P., LTD
P.O. BOX 1484 OF GENERAL POST OFFICE
HONG KONG, HONG KONG

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