Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/14/2020
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Application #:
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16060278
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Filing Dt:
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06/07/2018
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Publication #:
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Pub Dt:
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12/13/2018
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Inventors:
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Sung-Won Seo, Jeong-O Mun, Jong-Ha Jeong, Jong-Woon Choi
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Title:
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CELL MODULE ASSEMBLY HAVING IMPROVED SAFETY AND PACK STRUCTURE FOR THE CELL MODULE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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JOHN J. PENNY, JR. |
155 SEAPORT BOULEVARD |
NUTTER MCCLENNEN & FISH LLP |
BOSTON, MA 02210 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PARC. 1, TOWER ONE |
108 YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07335 |
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DENTONS US LLP |
1900 K STREET NW |
WASHINGTON, DC 20006 |
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