Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/21/2020
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Application #:
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15911290
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Filing Dt:
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03/05/2018
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Publication #:
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Pub Dt:
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07/05/2018
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Inventors:
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CHIH-CHENG HSIEH, HSIU-WEN HSU
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Title:
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MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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12F., NO.368, GONGJIAN RD., XIZHI DIST. |
NEW TAIPEI CITY, TAIWAN 221 |
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9F.-1, NO.100, SEC. 1, JIAFENG 11TH RD., ZHUBEI CITY |
HSINCHU COUNTY, TAIWAN 302 |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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05/24/2024 01:35 AM
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