Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2020
|
Application #:
|
15935213
|
Filing Dt:
|
03/26/2018
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2019
| | | | |
|
Inventors:
|
Lei Su, Xiaofei Yang, Xu Liu, Xun Mou, Yawen Zhu
|
|
Title:
|
Via-hole Connection Structure And Method Of Manufacturing The Same, And Array Substrate And Method Of Manufacturing The Same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT |
| BEIJING, CHINA 100015 |
|
|
|
| NO. 1188 HEZUO RD., (WEST ZONE), HI-TECH |
| DEVELOPMENT ZONE, SICHUAN PROVINCE |
| CHENGDU, CHINA 611731 |
|
|
|
|
| JUDSON K. CHAMPLIN |
| 900 SECOND AVENUE SOUTH, STE. 1400 |
| MINNEAPOLIS, MN 55402 |
|
|
Search Results as of:
06/03/2024 01:37 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
