Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/12/2020
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Application #:
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16278539
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Filing Dt:
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02/18/2019
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Inventors:
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Junjing Bao, Giridhar Nallapati, Periannan Chidambaram
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Title:
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INTEGRATED CIRCUIT (IC) INTERCONNECT STRUCTURE HAVING A METAL LAYER WITH ASYMMETRIC METAL LINE-DIELECTRIC STRUCTURES SUPPORTING SELF-ALIGNED VERTICAL INTERCONNECT ACCESSES (VIAS)
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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W&T/QUALCOMM |
106 PINEDALE SPRINGS WAY |
CARY, NC 27511 |
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06/19/2024 07:48 AM
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