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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10658333
Issue Dt:
05/19/2020
Application #:
16199230
Filing Dt:
11/26/2018
Publication #:
20200043893
Pub Dt:
02/06/2020
Inventors:
Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh
Title:
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
047576/0516Recorded: 11/26/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CH, HSIEN-WEI EN
Exec Dt:
11/14/2018
CHEN, MING-FA
Exec Dt:
11/14/2018
YEH, SUNG-FENG
Exec Dt:
11/13/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI, 10099 TAIWAN
Assignment: 2
Reel/Frame:
052386/0289Recorded: 04/14/2020Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THE FIRST ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 047576 FRAME 0516. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
CHEN, HSIEN-WEI
Exec Dt:
11/14/2018
CHEN, MING-FA
Exec Dt:
11/14/2018
YEH, SUNG-FENG
Exec Dt:
11/13/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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