Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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15240422
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Filing Dt:
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08/18/2016
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Publication #:
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Pub Dt:
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02/22/2018
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Inventors:
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Yu-Jen CHENG, Yu-Chih HUANG, Chih-Hua CHEN, Yu-Feng CHEN, Hao-Yi TSAI
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Title:
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METHOD FOR FORMING A PACKAGE STRUCTURE INCLUDING A PACKAGE LAYER SURROUNDING FIRST CONNECTORS BESIDE AN INTEGRATED CIRCUIT DIE AND SECOND CONNECTORS BELOW THE INTEGRATED CIRCUIT DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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