Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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15853173
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Filing Dt:
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12/22/2017
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Publication #:
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Pub Dt:
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06/27/2019
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Inventors:
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Lizabeth Keser, Thomas Ort, Bernd Waidhas, Thomas Wagner
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Title:
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PACKAGE INCLUDING AN INTEGRATED ROUTING LAYER AND A MOLDED ROUTING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ANGELA MILLER |
| C/O CPA GLOBAL |
| 900 SECOND AVENUE SOUTH, SUITE 600 |
| MINNEAPOLIS, MN 55402 |
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