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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10669054
Issue Dt:
06/02/2020
Application #:
15925676
Filing Dt:
03/19/2018
Inventors:
Brian Hoffman, Cory Richard Boudreau, Todd Ethan Brunner, David C. Franchino et al
Title:
RIGHT-SIZED THERMOFORMED CAVITIES FOR PACKAGING ITEMS
Assignment: 1
Reel/Frame:
052516/0261Recorded: 04/28/2020Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HOFFMAN, BRIAN
Exec Dt:
03/26/2020
BOUDREAU, CORY RICHARD
Exec Dt:
04/04/2020
BRUNNER, TODD ETHAN
Exec Dt:
04/06/2020
FRANCHINO, DAVID F.
Exec Dt:
04/04/2020
LIN, VIVIAN
Exec Dt:
04/15/2020
MAHADEVAN, MOHAN
Exec Dt:
03/27/2020
MATRECANO, JOHN GAETANO
Exec Dt:
03/26/2020
SURASKY-YSASI, ALEXANDRA
Exec Dt:
04/22/2020
TALDA, TIMOTHY ALAN
Exec Dt:
03/26/2020
Assignee:
AMAZON TECHNOLOGIES, INC.
PO BOX 81226
SEATTLE, WASHINGTON 98108-1226
Correspondent:
ATHORUS, PLLC
P.O. BOX 579
MOUNT VERNON, WA 98273
Assignment: 2
Reel/Frame:
052655/0769Recorded: 05/13/2020Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HARTFORD, ALEXANDRA KAY
Exec Dt:
05/12/2020
Assignee:
AMAZON TECHNOLOGIES, INC.
PO BOX 81226
SEATTLE, WASHINGTON 98108-1226
Correspondent:
ATHORUS, PLLC
PO BOX 579
MOUNT VERNON, WA 98273

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