Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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15013881
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Filing Dt:
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02/02/2016
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Publication #:
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Pub Dt:
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08/04/2016
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Inventors:
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Chia-Wei Li, Yen-Ni Hu
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH PREFERRED HEAT DISSIPATING EFFICACY WITHOUT FORMATION OF SHORT CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO. 43, FUXING RD., XINDIAN DIST. |
| NEW TAIPEI CITY 23150, TAIWAN R.O.C. |
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| KAMRATH IP LAWFIRM, PA |
| 4825 OLSON MEMORIAL HIGHWAY, SUITE 150 |
| GOLDEN VALLEY, MN 55422 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ADD SECOND ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 037649 FRAME: 0964. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2F., NO. 43, FUXING RD., XINDIAN DIST. |
| NEW TAIPEI CITY 23150, TAIWAN R.O.C. |
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| KAMRATH IP LAWFIRM, P.A. |
| 4825 OLSON MEMORIAL HWY., SUITE 150 |
| GOLDEN VALLEY, MN 55422 |
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