Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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16054987
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Filing Dt:
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08/03/2018
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Publication #:
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Pub Dt:
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02/07/2019
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Inventors:
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KE-HAO PAN, SHENG-WEI CHOU, YI-SHENG LAN, CHIA-FONG CHOU, CHUNG-CHUAN HSIEH, JEN-HAO PAN et al
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Title:
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LED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6-8, ZHONGHUA ROAD, SHULIN DISTRICT |
| NEW TAIPEI CITY, TAIWAN 23860 |
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| J.C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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