Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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16390481
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Filing Dt:
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04/22/2019
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Inventors:
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Hua-Feng CHEN, Chih-Cheng CHOU
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Title:
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THERMAL MODULE MOUNTING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F, NO. 166, JIAN YI ROAD, |
| ZHONGHE DISTRICT |
| NEW TAIPEI CITY, R.O.C., TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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