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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/16/2020
Application #:
15879183
Filing Dt:
01/24/2018
Publication #:
Pub Dt:
07/25/2019
Inventors:
Feng Zhou, Ki Wook Jung, Ercan M. Dede
Title:
MULTI-LAYER COOLING STRUCTURE INCLUDING THROUGH-SILICON VIAS THROUGH A PLURALITY OF DIRECTLY-BONDED SUBSTRATES AND METHODS OF MAKING THE SAME
Assignment: 1
Reel/Frame:
044721/0156Recorded: 01/24/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/19/2018
Exec Dt:
01/19/2018
Exec Dt:
01/19/2018
Assignee:
25 ATLANTIC AVENUE
ERLANGER, KENTUCKY 41018
Correspondent:
DINSMORE & SHOHL LLP
255 E. 5TH STREET
SUITE 1900
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
052926/0704Recorded: 06/12/2020Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/03/2020
Assignee:
1, TOYOTA-CHO
TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET, SUITE 1900
CINCINNATI, OH 45202

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