Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/23/2020
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Application #:
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15389417
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Filing Dt:
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12/22/2016
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Publication #:
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Pub Dt:
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07/06/2017
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Inventors:
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Chieh CHEN, Tsung-Hsi WANG
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Title:
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CHIP SCALE PACKAGING LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2F. NO 29, GONGYE E. 9TH ROAD |
HSINCHU COUNTY, TAIWAN 30075 |
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FOLEY & LARDNER LLP / MARK J. DANIELSON |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007-5109 |
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09/25/2024 01:47 PM
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