Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/30/2020
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Application #:
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15528960
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Filing Dt:
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05/23/2017
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Publication #:
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Pub Dt:
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09/21/2017
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Inventors:
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Shinichi KAZAMA, Ken UCHIDA, Yoshitake TERASHI
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Title:
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RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6, TAKEDA TOBADONO-CHO |
FUSHIMI-KU |
KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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VOLPE AND KOENIG, P.C. |
UNITED PLAZA |
30 SOUTH 17TH STREET, 18TH FLOOR |
PHILADELPHIA, PA 19103 |
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