Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/30/2020
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Application #:
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16124448
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Filing Dt:
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09/07/2018
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Publication #:
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Pub Dt:
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03/14/2019
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Inventors:
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Ralf Otremba, Amirul Afiq Hud, Teck Sim Lee, Xaver Schloegel, Bernd Schmoelzer
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Title:
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SMD Package with Top Side Cooling
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
1255 CRESCENT GREEN |
SUITE 200 |
CARY, NC 27518 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR TECK SIM LEE'S LAST NAME PREVIOUSLY RECORDED ON REEL 049381 FRAME 0565. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR LAST NAME SHOULD BE LEE, NOT SIM LEE.
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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MURPHY, BILAK & HOMILLER/INFINEON |
1255 CRESCENT GREEN, SUITE 200 |
CARY, NC 27518 |
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09/23/2024 02:26 AM
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