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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/30/2020
Application #:
15993149
Filing Dt:
05/30/2018
Publication #:
Pub Dt:
05/30/2019
Inventors:
CHIH-LIANG CHEN, LEI-CHUN CHOU, JACK LIU, KAM-TOU SIO, HUI-TING YANG, WEI-CHENG LIN et al
Title:
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED INTEGRATED CIRCUIT AND FABRICATION METHOD
Assignment: 1
Reel/Frame:
046295/0058Recorded: 07/09/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Exec Dt:
06/22/2018
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Exec Dt:
06/21/2018
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
1100 QUAIL STREET, SUITE 202
NEWPORT BEACH, CA 92660

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