Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/07/2020
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Application #:
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15515480
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Filing Dt:
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03/29/2017
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Publication #:
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Pub Dt:
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08/16/2018
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Inventors:
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Jan Richter, Christian Beyer, Anas Ajaj
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Title:
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COMBINED WAFER PRODUCTION METHOD WITH A MULTI-COMPONENT RECEIVING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MANFRED-VON-ARDENNE-RING 7 |
| DRESDEN, GERMANY 01099 |
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| MURPHY, BILAK & HOMILLER/INFINEON |
| 1255 CRESCENT GREEN, SUITE 200 |
| CARY, NC 27518 |
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